W25Q64DW
10.2 INSTRUCTIONS
The Standard/Dual/Quad SPI instruction set of the W25Q64DW consists of thirty six basic instructions
that are fully controlled through the SPI bus (see Instruction Set table1-3). Instructions are initiated with
the falling edge of Chip Select (/CS). The first byte of data clocked into the DI input provides the
instruction code. Data on the DI input is sampled on the rising edge of clock with most significant bit
(MSB) first.
The QPI instruction set of the W25Q64DW consists of twenty four basic instructions that are fully
controlled through the SPI bus (see Instruction Set table 4). Instructions are initiated with the falling edge
of Chip Select (/CS). The first byte of data clocked through IO[3:0] pins provides the instruction code. Data
on all four IO pins are sampled on the rising edge of clock with most significant bit (MSB) first. All QPI
instructions, addresses, data and dummy bytes are using all four IO pins to transfer every byte of data with
every two serial clocks (CLK).
Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data
bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the
rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in figures 5
through 42. All read instructions can be completed after any clocked bit. However, all instructions that
Write, Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been
clocked) otherwise the instruction will be ignored. This feature further protects the device from inadvertent
writes. Additionally, while the memory is being programmed or erased, or when the Status Register is
being written, all instructions except for Read Status Register will be ignored until the program or erase
cycle has completed.
10.2.1 Manufacturer and Device Identification
MANUFACTURER ID
Winbond Serial Flash
(MF7 - MF0)
EFh
Device ID
Instruction
W25Q64DW
(ID7 - ID0)
ABh, 90h, 92h, 94h
16h
- 18 -
(ID15 - ID0)
9Fh
6017h
相关PDF资料
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相关代理商/技术参数
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W25Q64DWZPIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVDAIG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
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W25Q64FVSFIG 功能描述:IC SPI FLASH 64MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M(256K x 18) 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x20) 包装:托盘
W25Q64FVSFIG TR 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 16SOIC
W25Q64FVSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI